摘要
Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 1256-1259 |
| 页数 | 4 |
| 期刊 | Microelectronic Engineering |
| 卷 | 84 |
| 期 | 5-8 |
| DOI | |
| 出版状态 | 已出版 - 5月 2007 |
| 已对外发布 | 是 |
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