TY - GEN
T1 - Environment friendly MEMS fabrication
T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
AU - Naeano, Shuji
AU - Shibata, Toshinori
AU - Sakoda, Kaoru
AU - Inoue, Minoru
AU - Hasaka, Satoshi
AU - Takano, Takayuki
AU - Ikehara, Tsuyoshi
AU - Maeda, Ryutaro
PY - 2007
Y1 - 2007
N2 - Environmental emission volume of green house gases such as SF6 and QF8, consumed for Si deep etching process in MEMS fabrication, are increasing followed by the MEMS market growth. To reduce the emitted green house gases, alternative C3F6 and IF5 were investigated to be applied for MEMS etching process instead of conventional Bosch process gases. The C3F6 and IF5 gases have very small global warming potential, so that they were useful to reduce over 95% of the green house gases maintaining the good etching performance on both etching rate and etching profile. The reduction of warming gas emission by the new gases is estimated that approximately 43 trees might be conserved during one etching process of a wafer to 300 μm. In addition to this merit, IF 5 is found to be applied for anisotropic trench etching without Bosch process.
AB - Environmental emission volume of green house gases such as SF6 and QF8, consumed for Si deep etching process in MEMS fabrication, are increasing followed by the MEMS market growth. To reduce the emitted green house gases, alternative C3F6 and IF5 were investigated to be applied for MEMS etching process instead of conventional Bosch process gases. The C3F6 and IF5 gases have very small global warming potential, so that they were useful to reduce over 95% of the green house gases maintaining the good etching performance on both etching rate and etching profile. The reduction of warming gas emission by the new gases is estimated that approximately 43 trees might be conserved during one etching process of a wafer to 300 μm. In addition to this merit, IF 5 is found to be applied for anisotropic trench etching without Bosch process.
UR - https://www.scopus.com/pages/publications/52349104939
M3 - 会议稿件
AN - SCOPUS:52349104939
SN - 1424409519
SN - 9781424409518
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 341
EP - 344
BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Y2 - 21 January 2007 through 25 January 2007
ER -