Enhanced heat transfer in bioinspired manifold microchannels with porous copper for efficient thermal management of high-power electronic devices

The rapid miniaturization and performance enhancement of wide-bandgap semiconductor devices have intensified the need for efficient thermal management. Conventional cooling methods increasingly fall short, prompting the development of bioinspired manifold microchannel heat sinks. This study investigates the thermal and hydraulic performance of bioinspired manifold microchannels fabricated from foamy copper, focusing on the effects of pore density, flow velocity, and trunk height on the boiling heat transfer. Experimental results indicate that microchannels with low pore density (20 PPI) achieve significantly higher heat transfer coefficients (HTC) and critical heat flux (CHF) compared to those with higher pore densities (40 and 60 PPI), albeit at the cost of increased pressure drop. Additionally, while higher flow velocities improve both HTC and CHF, they also lead to substantial pressure losses, compromising overall system efficiency. The influence of trunk height becomes more pronounced at high flow velocities, with taller trunks yielding higher average HTC. These findings highlight the trade-offs between heat transfer enhancement and flow resistance, offering valuable guidance for optimizing thermal management in high-power electronic systems.