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EMI Analysis of Full-SiC Integrated Power Module

  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节会议稿件同行评审

13 引用 (Scopus)

摘要

Due to the high dv/dt and di/dt slew rates, the electromagnetic interference (EMI) issue in the high power level power module is serious. In this paper, a novel EMI model of full-SiC power module is proposed based on the ANSYS Q3D software and the EMI mechanical is analyzed by discussing the EMI coupling paths both in common-mode (CM) interference and differential-mode (DM) interference. Then, a synchronous buck converter based on the full-SiC power module is simulated in the ANSYS Simplorer software. Finally, a synchronous buck experimental platform based on a 1200V, 288A full-SiC power module is tested. It is found that the intensity of EMI increases as the voltage and current of power module increase. The intensity of the CM EMI presents uniform distribution along with frequency and a resonant peak appears at specific frequency points of the DM EMI.

源语言英语
主期刊名2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
出版商Institute of Electrical and Electronics Engineers Inc.
3329-3331
页数3
ISBN(电子版)9784886864055
DOI
出版状态已出版 - 22 10月 2018
活动8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, 日本
期限: 20 5月 201824 5月 2018

丛书

姓名2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

会议

会议8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
国家/地区日本
Niigata
时期20/05/1824/05/18

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