TY - GEN
T1 - Electroosmosis performance analysis of microchip electrophoresis fabricated by the ultra-precision CNC milling
AU - Tian, Li
AU - Wang, Wei
AU - Liu, Xiaowei
PY - 2012
Y1 - 2012
N2 - Ultra precision CNC milling can be used to fabricate the Microchip electrophoresis on the substrate of PMMA which exhibited a better electro-osmosis performance. All micro-channels on the chip are 150μm x 140μm in section area, and the separation micro-channel is 5 cm long. The top chip and the bottom one are packaged with hot embossing technique with the ponder pressing machine at the condition of 80°, 0Pa,5min. EOF performance is theoretical studied based on the theory of low Reynolds Number, electro-osmotic mobility could be calculated μ eo=2.3×10 -4cm 2/Vs. While the experiment test EOF with current monitoring method show that the apparent electro-osmosis mobility is μ eo=3.02×10 -4cm 2/Vs at pH9.18, 5mmol/L borax buffer solution. The difference between the theory calculation and experiment results could be explained by the XPS test which indicate that the surface valent bonds intensity were strengthened after milling fabrication.
AB - Ultra precision CNC milling can be used to fabricate the Microchip electrophoresis on the substrate of PMMA which exhibited a better electro-osmosis performance. All micro-channels on the chip are 150μm x 140μm in section area, and the separation micro-channel is 5 cm long. The top chip and the bottom one are packaged with hot embossing technique with the ponder pressing machine at the condition of 80°, 0Pa,5min. EOF performance is theoretical studied based on the theory of low Reynolds Number, electro-osmotic mobility could be calculated μ eo=2.3×10 -4cm 2/Vs. While the experiment test EOF with current monitoring method show that the apparent electro-osmosis mobility is μ eo=3.02×10 -4cm 2/Vs at pH9.18, 5mmol/L borax buffer solution. The difference between the theory calculation and experiment results could be explained by the XPS test which indicate that the surface valent bonds intensity were strengthened after milling fabrication.
KW - Computer Numerical Control (CNC) Milling
KW - Current Monitor Method
KW - Electro-osmosis Flow(EOF)
KW - Microchip Electrophoresis (MCE)
UR - https://www.scopus.com/pages/publications/84868239996
U2 - 10.1109/ICDMA.2012.255
DO - 10.1109/ICDMA.2012.255
M3 - 会议稿件
AN - SCOPUS:84868239996
SN - 9780769547725
T3 - Proceedings - 2012 3rd International Conference on Digital Manufacturing and Automation, ICDMA 2012
SP - 380
EP - 383
BT - Proceedings - 2012 3rd International Conference on Digital Manufacturing and Automation, ICDMA 2012
T2 - 2012 3rd International Conference on Digital Manufacturing and Automation, ICDMA 2012
Y2 - 31 July 2012 through 2 August 2012
ER -