Effects of NH₄F on the deposition rate and buffering capability of electroless Ni-P plating solution

The deposition rate and buffering capability of alkaline electroless Ni-P plating solution containing ammonium fluoride (NH₄F) have been investigated. When the NH₄F concentration is below 10 g L^{- 1}, the deposition rate is improved with the addition of NH₄F, reaching the maximum value at 2 g L^{- 1}. The buffering capability of solutions is found to be improved with increasing NH₄F concentration. Due to the improvement of buffering capability, refined and compact Ni-P coatings with homogeneous elemental distribution of P have been achieved. Therefore, both the corrosion resistance and microhardness of Ni-P coatings are significantly improved. The mechanism of NH₄F improving the deposition rate and the buffering capability is discussed.