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Effect of Micronscale and Nanoscale Boron Nitride Fillers on AC Breakdown Performances of Polytetrafluoroethylene

  • Bingchen Song
  • , Zhaozi Zhang
  • , Yongjie Nie
  • , Qinrong Li
  • , Pengxin Li
  • , Jiachi Yao
  • , Daomin Min
  • , Liangxian Zhang
  • , Shengtao Li
  • Xi'an Jiaotong University
  • Xi'an XD High Voltage Apparatus Co. Ltd.

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

During the breaking process of high voltage circuit breaker (HVCB), the arcs generated between the contacts may cause severe electrical breakdown of the nozzle, shortening the life of HVCB. Therefore, nozzles with superior performance are urgently needed. Our previous experiments prepared several polytetrafluoroethylene (PTFE) samples doped with different micron-scale and nanoscale boron nitride (BN) to study the influence of these fillers on the arc ablation resistance. The experiment results show that the addition of micron-BN can greatly improve the arc ablation resistance of PTFE. However, the influence of those fillers on the breakdown performances is still unclear. And the actual nozzle needs to have both excellent ablation and breakdown resistance. So PTFE filled with different size of micron-BN and nano-BN was prepared in this paper to study the effect of micron-scale or nanoscale BN on the AC breakdown performance of PTFE. The change of trap depth and trap density will influence the composites' charge transport properties. The AC breakdown experiment was done to test the samples' breakdown strength. The experiment results of different samples are compared to get the best particle size of the BN fillers. And the relationship between the breakdown performance and the trap parameters is discussed. These factors are considered to be closely related.

源语言英语
主期刊名7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781728155111
DOI
出版状态已出版 - 6 9月 2020
活动7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Beijing, 中国
期限: 6 9月 202010 9月 2020

出版系列

姓名7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings

会议

会议7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020
国家/地区中国
Beijing
时期6/09/2010/09/20

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