TY - GEN
T1 - Effect of initial opening speed on the behavior of vacuum arcs driven by transverse magnetic fields (TMF)
AU - Dingyu, Feng
AU - Shixin, Xiu
AU - Gang, Liu
AU - Jiahuan, Zheng
AU - Yu'An, Gan
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/18
Y1 - 2014/11/18
N2 - Transverse magnetic field (TMF) can force the arc to move circularly on the contacts thus avoid severe local overheating. In this paper, an experimental system was established to study the effect of initial opening speed characteristics on vacuum arc with two different TMF contact structures. Cup-shaped and Wan-type CuCr contacts with the same diameter of 30mm were investigated in a demountable vacuum chamber. Short-circuit currents were provided by a single-frequency oscillation circuit. By using a high-speed charge coupled device (CCD) video camera, the appearance of vacuum arcs was observed and investigated regarding different initial opening speeds. The results were analyzed by 3D finite element analysis. It was showed that with the increase of arc currents, the acceleration of opening speed will shorten the duration of transition arc mode and promote vacuum arc to go diffuse.
AB - Transverse magnetic field (TMF) can force the arc to move circularly on the contacts thus avoid severe local overheating. In this paper, an experimental system was established to study the effect of initial opening speed characteristics on vacuum arc with two different TMF contact structures. Cup-shaped and Wan-type CuCr contacts with the same diameter of 30mm were investigated in a demountable vacuum chamber. Short-circuit currents were provided by a single-frequency oscillation circuit. By using a high-speed charge coupled device (CCD) video camera, the appearance of vacuum arcs was observed and investigated regarding different initial opening speeds. The results were analyzed by 3D finite element analysis. It was showed that with the increase of arc currents, the acceleration of opening speed will shorten the duration of transition arc mode and promote vacuum arc to go diffuse.
UR - https://www.scopus.com/pages/publications/84919382654
U2 - 10.1109/DEIV.2014.6961646
DO - 10.1109/DEIV.2014.6961646
M3 - 会议稿件
AN - SCOPUS:84919382654
T3 - Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
SP - 169
EP - 172
BT - ISDEIV 2014 - Proceedings of the 26th International Symposium on Discharges and Electrical Insulation in Vacuum
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014
Y2 - 28 September 2014 through 3 October 2014
ER -