@inproceedings{098e1e2fefc54e35a8dab3899ebe8502,
title = "Effect of a thin Cr layer on the microstructures and fracture behaviours of copper films",
abstract = "An investigation on Cu/Cr/Si composite thin films demonstrated that a thin Cr layer affects the microstructures and mechanical behavior of Cu films significantly. The fracture modes changes from brittle fracture to ductile rupture, as indicated by the dimpled rupture of Cu films. Moreover, the Cr sticking layer can result in carrot-shaped rods and a fine grain size. Further analysis indicates their deformation and fracture processes are closely related to the coupling of dislocation-mediated plasticity as well as the formation and growth of voids which act as sites for nucleation of the dimples.",
keywords = "Cu/Cr films, Dimple, Fracture, Microstructure, Sputtering",
author = "Sun, \{Hao Liang\} and Song, \{Zhong Xiao\} and Fei Ma and Xu, \{Ke Wei\}",
year = "2011",
doi = "10.4028/www.scientific.net/AMR.194-196.2376",
language = "英语",
isbn = "9783037850336",
series = "Advanced Materials Research",
pages = "2376--2379",
booktitle = "Advanced Engineering Materials",
note = "2nd International Conference on Manufacturing Science and Engineering, ICMSE 2011 ; Conference date: 09-04-2011 Through 11-04-2011",
}