Directed block copolymer self-assembly for next-generation lithography

Block copolymer (BCP)–directed self-assembly (DSA) is a transformative lithography technique set to revolutionize semiconductor manufacturing by enabling patterning with high resolution, low cost, and high throughput. It addresses the limitations of conventional lithography in achieving advance miniaturization by leveraging the self-assembly of BCPs. Advances in high Flory–Huggins interaction parameter BCPs and annealing processes have enabled diverse morphologies and sub-10-nm resolutions. The successful demonstration in fabricating advanced semiconductor devices, along with 300-mm wafer pilot lines, signals imminent industrial adoption. However, the lack of computational lithography and electronic design automation tools remains a critical bottleneck. Collaborative efforts across materials, processes, and simulation are vital for integrating DSA into the lithography ecosystem, driving the semiconductor industry's future innovation.