TY - GEN
T1 - Diamond-like carbon based micro-pressure sensor with ultra-thin sensitive membrane
AU - Ma, Xin
AU - Zhang, Qi
AU - Guo, Peng
AU - Zhao, Yulong
AU - Wang, Aiying
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - in this study, diamond-like carbon (DLC) piezoresistive film and ultra-thin sensitive membrane structure (580 nm thick Si3N4/SiO2) were used for the micro-pressure sensors to improve the sensitivity. High power impulse magnetron sputtering (HiPIMS) process was used to deposit DLC film with high gauge factor (GF), and the wet-etching process was used to fabricate the ultra-thin sensitive structure. Based on Raman spectra, the size of sp2 clusters slightly increased after the release of the internal stress, which might reduce the GF of the DLC film. However, the DLC based sensor still showed high sensitivity of 3.2×10-4/kPa, good non-linearity of 2.4% FS and satisfied repeatability. This work showed an efficient and economical method to improve the performance of the micro-pressure sensors.
AB - in this study, diamond-like carbon (DLC) piezoresistive film and ultra-thin sensitive membrane structure (580 nm thick Si3N4/SiO2) were used for the micro-pressure sensors to improve the sensitivity. High power impulse magnetron sputtering (HiPIMS) process was used to deposit DLC film with high gauge factor (GF), and the wet-etching process was used to fabricate the ultra-thin sensitive structure. Based on Raman spectra, the size of sp2 clusters slightly increased after the release of the internal stress, which might reduce the GF of the DLC film. However, the DLC based sensor still showed high sensitivity of 3.2×10-4/kPa, good non-linearity of 2.4% FS and satisfied repeatability. This work showed an efficient and economical method to improve the performance of the micro-pressure sensors.
KW - diamond-like carbon
KW - internal stress
KW - micro-pressure sensor
KW - piezoresistive
KW - ultra-thin structure
UR - https://www.scopus.com/pages/publications/85123634979
U2 - 10.1109/SENSORS47087.2021.9639481
DO - 10.1109/SENSORS47087.2021.9639481
M3 - 会议稿件
AN - SCOPUS:85123634979
T3 - Proceedings of IEEE Sensors
BT - 2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Sensors, SENSORS 2021
Y2 - 31 October 2021 through 4 November 2021
ER -