TY - GEN
T1 - Development of Single Diamond Substrate and Devices
AU - Wang, Yan Feng
AU - Wang, Ruozheng
AU - Wei, Qiang
AU - Wen, Feng
AU - Wang, Wei
AU - Wang, Hong Xing
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Fabrication of large size single-crystal diamond and related devices attracts great efforts to make progress in diamond field. In this work, 2 inch single-crystal substrate has been developed and put into production. First, the temperature field in the MPCVD chamber was adjusted and made an uniform temperature distribution. Second, a growth of 2 inch diamond substrate has been carried out, and the XRD (004) FWHM indicates a low value of 91 arcsec. Based on the substrate, diamond RF and power MOSFETs have been developed, which meets the practical application. Also, the enhanced/depletion model logic circuit has been fabricated.
AB - Fabrication of large size single-crystal diamond and related devices attracts great efforts to make progress in diamond field. In this work, 2 inch single-crystal substrate has been developed and put into production. First, the temperature field in the MPCVD chamber was adjusted and made an uniform temperature distribution. Second, a growth of 2 inch diamond substrate has been carried out, and the XRD (004) FWHM indicates a low value of 91 arcsec. Based on the substrate, diamond RF and power MOSFETs have been developed, which meets the practical application. Also, the enhanced/depletion model logic circuit has been fabricated.
UR - https://www.scopus.com/pages/publications/85214988357
U2 - 10.1109/LTB-3D64053.2024.10774149
DO - 10.1109/LTB-3D64053.2024.10774149
M3 - 会议稿件
AN - SCOPUS:85214988357
T3 - 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
BT - 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
Y2 - 30 October 2024 through 1 November 2024
ER -