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Development of Single Diamond Substrate and Devices

  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

2 引用 (Scopus)

摘要

Fabrication of large size single-crystal diamond and related devices attracts great efforts to make progress in diamond field. In this work, 2 inch single-crystal substrate has been developed and put into production. First, the temperature field in the MPCVD chamber was adjusted and made an uniform temperature distribution. Second, a growth of 2 inch diamond substrate has been carried out, and the XRD (004) FWHM indicates a low value of 91 arcsec. Based on the substrate, diamond RF and power MOSFETs have been developed, which meets the practical application. Also, the enhanced/depletion model logic circuit has been fabricated.

源语言英语
主期刊名2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798331519919
DOI
出版状态已出版 - 2024
活动8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024 - Nara, 日本
期限: 30 10月 2024 → 1 11月 2024

丛书

姓名2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024

会议

会议8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
国家/地区日本
市Nara
时期30/10/24 → 1/11/24

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