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Developing MEMS electric current sensors for end-use monitoring of power supply: Part XI - A nonlinear error correction scheme

  • Jilin University
  • National Institute of Advanced Industrial Science and Technology
  • The University of Tokyo

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Cantilever current sensors (CCS) have received increasing attention recently because of a passive sensing signal correlating to a linear detecting one. When a two-wire appliance is energized however, the distance between the cantilever and the two-wire appliance will become a time variable, which will undermine the above linear relationship. As a result, a nonlinear error is generated, and the measurement accuracy is thus decreased. The larger the amplitude of the cantilever is, the greater the nonlinear error is. In this study, a nonlinear error correction scheme is proposed for the first time without decreasing the sensitivity. Since the nonlinear error can be decreased by increasing the initial distance, while the sensitivity of the cantilever current sensor (CCS) is also decreased. Therefore, it is necessary to compensate for the decrease in the sensitivity by increasing the magnetic induction intensity of the magnet located on the cantilever. When the magnetic induction intensity is increased by 3 times, the initial distance can be increased from 3.5 mm to 5.5mm while maintaining the same sensitivity, and the nonlinear error is decreased from 47% to 32%. The proposed correction scheme is proven to be valid for decreasing the nonlinearity error while maintaining the sensitivity.

源语言英语
主期刊名2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781665402309
DOI
出版状态已出版 - 25 8月 2021
已对外发布
活动2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021 - Paris, 法国
期限: 25 8月 202127 8月 2021

出版系列

姓名2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021

会议

会议2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
国家/地区法国
Paris
时期25/08/2127/08/21

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