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Developing MEMS electric current sensors for end-use monitoring of power supply: Part X - An IEEE802.11g protocol compliant integratable dual-frequency coaxial microstrip antenna

  • Liqiang Fan
  • , Dong F. Wang
  • , Toshihiro Itoh
  • , Zhongpeng Yu
  • , Ryutaro Maeda
  • Jilin University
  • National Institute of Advanced Industrial Science and Technology
  • The University of Tokyo
  • Engineering Maintenance Department

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In our initial work of DTIP, a passive DC MEMS current sensor was proposed for single-wire or dual-wire current detection (DTIP2011, DTIP2012). A new type of oscillating MEMS DC current sensor, composed of an excitation element and a sensing element, was further proposed in DTIP2013. Since then, a series of studies, such as cantilever-based magnetic field sensor device (DTIP2014), corresponding relation between polarization and output voltage (DTIP2015), corresponding relationship between sensitivity and magnetic inductance (DTIP2017), magnetic field distribution surrounding three-phase four-wire appliances (DTIP2018), segmentation design and empirical analysis of piezoeletric layers (DTIP2018), as well as threshold-triggered current sensing (DTIP2019), have been carried out from different aspects. This work however, is oriented to realize an IEEE802.11g protocol compliant integratable dual-frequency coaxial microstrip antenna for wireless sensor networks. The newly designed antenna can be operated under two frequency bands of 2.45GHz and 5.2GHz, meeting the new physical layer standard IEEE802.11g emerged in recent years. A wireless cantilever current sensor (WCCS) is conceptualized to be an integration of a magnetic cantilever for sensing currents and a dual-frequency coaxial microstrip antenna for transmitting signals.

源语言英语
主期刊名2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781665402309
DOI
出版状态已出版 - 25 8月 2021
已对外发布
活动2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021 - Paris, 法国
期限: 25 8月 202127 8月 2021

丛书

姓名2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021

会议

会议2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
国家/地区法国
Paris
时期25/08/2127/08/21

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