TY - GEN
T1 - Design of a resonant accelerometer integrated with a diamond like carbon film temperature sensor
AU - Li, Bo
AU - Zhao, Yulong
AU - Ma, Xin
AU - Li, Cun
AU - Zhang, Qi
AU - Zhao, You
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/21
Y1 - 2017/12/21
N2 - The design, fabrication and testing of a novel resonant accelerometer integrated with a temperature sensor is presented in this paper. The accelerometer consists of double quartz resonators and a silicon substrate. A novel diamond like carbon (DLC) film with special electrical property, excellent mechanical property and chemical stability, which has negative temperature coefficient of resistance (TCR), is employed to fabricate temperature sensors on the silicon substrate. Two types of DLC are prepared, one was hydrogenated amorphous carbon (A-C:H) films, the other one did not contain hydrogen. The test results demonstrate the feasibility of the proposed temperature sensor.
AB - The design, fabrication and testing of a novel resonant accelerometer integrated with a temperature sensor is presented in this paper. The accelerometer consists of double quartz resonators and a silicon substrate. A novel diamond like carbon (DLC) film with special electrical property, excellent mechanical property and chemical stability, which has negative temperature coefficient of resistance (TCR), is employed to fabricate temperature sensors on the silicon substrate. Two types of DLC are prepared, one was hydrogenated amorphous carbon (A-C:H) films, the other one did not contain hydrogen. The test results demonstrate the feasibility of the proposed temperature sensor.
KW - Diamond like carbon
KW - MEMS
KW - digital output signal
KW - resonant accelerometer
KW - temperature sensor
UR - https://www.scopus.com/pages/publications/85044258664
U2 - 10.1109/ICSENS.2017.8234144
DO - 10.1109/ICSENS.2017.8234144
M3 - 会议稿件
AN - SCOPUS:85044258664
T3 - Proceedings of IEEE Sensors
SP - 1
EP - 3
BT - IEEE SENSORS 2017 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE SENSORS Conference, ICSENS 2017
Y2 - 30 October 2017 through 1 November 2017
ER -