Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Sai Wei; Lukas W. Porz; Zhipeng Xie; Bin Liu; Juan Chen; Weijiang Xue; Jiamin Zhao

doi:10.1016/j.msea.2015.02.061

Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Sai Wei
, Lukas W. Porz
, Zhipeng Xie
, Bin Liu
, Juan Chen
, Weijiang Xue
, Jiamin Zhao

Tsinghua University
Technische Universität Darmstadt

科研成果: 期刊稿件 › 文章 › 同行评审

19 引用（Scopus）

摘要

Crack deflection angles and fracture modes were investigated by elaborative observation of 5764 crack deflections, generated at 77K, 159K, 293K and 500K, in silicon nitride (Si₃N₄) ceramics. In addition, the effects of grain boundary toughness on crack propagation in Si₃N₄ ceramics were statistically analyzed based on a two-dimensional, polycrystalline model. The results demonstrated that temperature (77-500K) had little influence on crack advance, but the change of grain boundary toughness contributed a lot to the change of crack propagation. The distribution of deflection angles varied distinctly and the fraction of transgranular fracture increased when the grain boundary toughness increased.

源语言	英语
页（从-至）	58-61
页数	4
期刊	Materials Science and Engineering: A
卷	632
DOI	https://doi.org/10.1016/j.msea.2015.02.061
出版状态	已出版 - 4 4月 2015
已对外发布	是

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title = "Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness",

abstract = "Crack deflection angles and fracture modes were investigated by elaborative observation of 5764 crack deflections, generated at 77K, 159K, 293K and 500K, in silicon nitride (Si3N4) ceramics. In addition, the effects of grain boundary toughness on crack propagation in Si3N4 ceramics were statistically analyzed based on a two-dimensional, polycrystalline model. The results demonstrated that temperature (77-500K) had little influence on crack advance, but the change of grain boundary toughness contributed a lot to the change of crack propagation. The distribution of deflection angles varied distinctly and the fraction of transgranular fracture increased when the grain boundary toughness increased.",

keywords = "Crack propagation, Fracture mode, Grain boundaries, Silicon nitride, Temperature",

author = "Sai Wei and Porz, \{Lukas W.\} and Zhipeng Xie and Bin Liu and Juan Chen and Weijiang Xue and Jiamin Zhao",

note = "Publisher Copyright: {\textcopyright} 2015.",

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day = "4",

doi = "10.1016/j.msea.2015.02.061",

language = "英语",

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TY - JOUR

T1 - Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

AU - Wei, Sai

AU - Porz, Lukas W.

AU - Xie, Zhipeng

AU - Liu, Bin

AU - Chen, Juan

AU - Xue, Weijiang

AU - Zhao, Jiamin

PY - 2015/4/4

Y1 - 2015/4/4

N2 - Crack deflection angles and fracture modes were investigated by elaborative observation of 5764 crack deflections, generated at 77K, 159K, 293K and 500K, in silicon nitride (Si3N4) ceramics. In addition, the effects of grain boundary toughness on crack propagation in Si3N4 ceramics were statistically analyzed based on a two-dimensional, polycrystalline model. The results demonstrated that temperature (77-500K) had little influence on crack advance, but the change of grain boundary toughness contributed a lot to the change of crack propagation. The distribution of deflection angles varied distinctly and the fraction of transgranular fracture increased when the grain boundary toughness increased.

AB - Crack deflection angles and fracture modes were investigated by elaborative observation of 5764 crack deflections, generated at 77K, 159K, 293K and 500K, in silicon nitride (Si3N4) ceramics. In addition, the effects of grain boundary toughness on crack propagation in Si3N4 ceramics were statistically analyzed based on a two-dimensional, polycrystalline model. The results demonstrated that temperature (77-500K) had little influence on crack advance, but the change of grain boundary toughness contributed a lot to the change of crack propagation. The distribution of deflection angles varied distinctly and the fraction of transgranular fracture increased when the grain boundary toughness increased.

KW - Crack propagation

KW - Fracture mode

KW - Grain boundaries

KW - Silicon nitride

KW - Temperature

UR - https://www.scopus.com/pages/publications/84924702662

U2 - 10.1016/j.msea.2015.02.061

DO - 10.1016/j.msea.2015.02.061

M3 - 文章

AN - SCOPUS:84924702662

SN - 0921-5093

VL - 632

SP - 58

EP - 61

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

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