Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

D. Jia; K. T. Ramesh; E. Ma; L. Lu; K. Lu

doi:10.1016/S1359-6462(01)01071-5

Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

D. Jia
, K. T. Ramesh
, E. Ma
, L. Lu
, K. Lu

Johns Hopkins University
CAS - Institute of Metal Research

科研成果: 期刊稿件 › 文章 › 同行评审

69 引用（Scopus）

摘要

Uniaxial compression tests for an electrodeposited nanocrystalline (nc) copper were performed at quasistatic and high strain rates. The grain sizes of the nc-copper were found using x-ray diffraction and transmission electron microscopy. The strength, strain hardening and strain rate dependence of the flow stress of nc-copper were compared with those of coarse-grained copper.

源语言	英语
页（从-至）	613-620
页数	8
期刊	Scripta Materialia
卷	45
期	5
DOI	https://doi.org/10.1016/S1359-6462(01)01071-5
出版状态	已出版 - 12 9月 2001
已对外发布	是

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abstract = "Uniaxial compression tests for an electrodeposited nanocrystalline (nc) copper were performed at quasistatic and high strain rates. The grain sizes of the nc-copper were found using x-ray diffraction and transmission electron microscopy. The strength, strain hardening and strain rate dependence of the flow stress of nc-copper were compared with those of coarse-grained copper.",

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AU - Jia, D.

AU - Ramesh, K. T.

AU - Ma, E.

AU - Lu, L.

AU - Lu, K.

PY - 2001/9/12

Y1 - 2001/9/12

N2 - Uniaxial compression tests for an electrodeposited nanocrystalline (nc) copper were performed at quasistatic and high strain rates. The grain sizes of the nc-copper were found using x-ray diffraction and transmission electron microscopy. The strength, strain hardening and strain rate dependence of the flow stress of nc-copper were compared with those of coarse-grained copper.

AB - Uniaxial compression tests for an electrodeposited nanocrystalline (nc) copper were performed at quasistatic and high strain rates. The grain sizes of the nc-copper were found using x-ray diffraction and transmission electron microscopy. The strength, strain hardening and strain rate dependence of the flow stress of nc-copper were compared with those of coarse-grained copper.

KW - Grain boundary

KW - High strain rate

KW - Stress-strain curve

KW - TEM

KW - nc-copper

UR - https://www.scopus.com/pages/publications/0035850589

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Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

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