TY - GEN
T1 - Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration
AU - Lu, Jian
AU - Takagi, Hideki
AU - Maeda, Ryutaro
PY - 2011
Y1 - 2011
N2 - In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3(CF 2) 7(CH 2) 2SiCl 3), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2O (∼μl/cm 2) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO 2 binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O 2 plasma treatment or UV irradiation.
AB - In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3(CF 2) 7(CH 2) 2SiCl 3), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2O (∼μl/cm 2) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO 2 binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O 2 plasma treatment or UV irradiation.
UR - https://www.scopus.com/pages/publications/84863038474
U2 - 10.1109/ICSENS.2011.6126924
DO - 10.1109/ICSENS.2011.6126924
M3 - 会议稿件
AN - SCOPUS:84863038474
SN - 9781424492886
T3 - Proceedings of IEEE Sensors
SP - 1121
EP - 1124
BT - IEEE Sensors 2011 Conference, SENSORS 2011
T2 - 10th IEEE SENSORS Conference 2011, SENSORS 2011
Y2 - 28 October 2011 through 31 October 2011
ER -