Binder system for micropowder injection molding

Z. Y. Liu; N. H. Loh; S. B. Tor; K. A. Khor; Y. Murakoshi; R. Maeda

doi:10.1016/S0167-577X(00)00276-7

Binder system for micropowder injection molding

Z. Y. Liu
, N. H. Loh
, S. B. Tor
, K. A. Khor
, Y. Murakoshi
, R. Maeda

Nanyang Technological University
National Institute of Advanced Industrial Science and Technology

科研成果: 期刊稿件 › 文章 › 同行评审

116 引用（Scopus）

摘要

To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

源语言	英语
页（从-至）	31-38
页数	8
期刊	Materials Letters
卷	48
期	1
DOI	https://doi.org/10.1016/S0167-577X(00)00276-7
出版状态	已出版 - 3月 2001
已对外发布	是

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title = "Binder system for micropowder injection molding",

abstract = "To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.\% PW+40 wt.\% EVA+40 wt.\% HDPE binder system.",

author = "Liu, \{Z. Y.\} and Loh, \{N. H.\} and Tor, \{S. B.\} and Khor, \{K. A.\} and Y. Murakoshi and R. Maeda",

year = "2001",

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doi = "10.1016/S0167-577X(00)00276-7",

language = "英语",

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T1 - Binder system for micropowder injection molding

AU - Liu, Z. Y.

AU - Loh, N. H.

AU - Tor, S. B.

AU - Khor, K. A.

AU - Murakoshi, Y.

AU - Maeda, R.

PY - 2001/3

Y1 - 2001/3

N2 - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

AB - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

UR - https://www.scopus.com/pages/publications/0034831527

U2 - 10.1016/S0167-577X(00)00276-7

DO - 10.1016/S0167-577X(00)00276-7

M3 - 文章

AN - SCOPUS:0034831527

SN - 0167-577X

VL - 48

SP - 31

EP - 38

JO - Materials Letters

JF - Materials Letters

IS - 1

ER -

Binder system for micropowder injection molding

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