An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling

X. L. Xie; Y. L. He; W. Q. Tao; H. W. Yang

doi:10.1016/j.applthermaleng.2007.05.010

An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling

X. L. Xie
, Y. L. He
, W. Q. Tao
, H. W. Yang

能源与动力工程学院

Xi'an Jiaotong University
Dalian Sunway Heat Transfer Technique Co. Ltd.

科研成果: 期刊稿件 › 文章 › 同行评审

33 引用（Scopus）

摘要

The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe-heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m³/h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.

源语言	英语
页（从-至）	433-439
页数	7
期刊	Applied Thermal Engineering
卷	28
期	5-6
DOI	https://doi.org/10.1016/j.applthermaleng.2007.05.010
出版状态	已出版 - 4月 2008

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10.1016/j.applthermaleng.2007.05.010

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title = "An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling",

abstract = "The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe-heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m3/h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.",

keywords = "Experimental investigation, Integrated heat pipe-heat sink, Thermal performance, Wick structure",

author = "Xie, \{X. L.\} and He, \{Y. L.\} and Tao, \{W. Q.\} and Yang, \{H. W.\}",

year = "2008",

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doi = "10.1016/j.applthermaleng.2007.05.010",

language = "英语",

volume = "28",

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AU - Xie, X. L.

AU - He, Y. L.

AU - Tao, W. Q.

AU - Yang, H. W.

PY - 2008/4

Y1 - 2008/4

N2 - The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe-heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m3/h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.

AB - The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe-heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m3/h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.

KW - Experimental investigation

KW - Integrated heat pipe-heat sink

KW - Thermal performance

KW - Wick structure

UR - https://www.scopus.com/pages/publications/38349185420

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DO - 10.1016/j.applthermaleng.2007.05.010

M3 - 文章

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SN - 1359-4311

VL - 28

SP - 433

EP - 439

JO - Applied Thermal Engineering

JF - Applied Thermal Engineering

IS - 5-6

ER -

An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling

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