TY - GEN
T1 - A tripod mechanism for parallelism alignment
T2 - 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
AU - Wenjie, Chen
AU - Guilin, Yang
AU - Wei, Lin
PY - 2009
Y1 - 2009
N2 - This paper presents a novel tripod mechanism used for precise parallelism alignment of one substrate plate with respect to another. The orientation of the top substrate plate is aligned through adjusting the lengths of pods. The parallelism of the two plates is measured through an on-board force sensor. To facilitate alignment, kinematics analysis of the tripod mechanism is conducted, and position and velocity of the carrier plate are formulated in a closed form. The tripod mechanism has been successfully applied in evaluation of a quantum tunneling linear encoder.
AB - This paper presents a novel tripod mechanism used for precise parallelism alignment of one substrate plate with respect to another. The orientation of the top substrate plate is aligned through adjusting the lengths of pods. The parallelism of the two plates is measured through an on-board force sensor. To facilitate alignment, kinematics analysis of the tripod mechanism is conducted, and position and velocity of the carrier plate are formulated in a closed form. The tripod mechanism has been successfully applied in evaluation of a quantum tunneling linear encoder.
UR - https://www.scopus.com/pages/publications/70449086409
U2 - 10.1109/AIM.2009.5229725
DO - 10.1109/AIM.2009.5229725
M3 - 会议稿件
AN - SCOPUS:70449086409
SN - 9781424428533
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 1047
EP - 1051
BT - 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2009
Y2 - 14 July 2009 through 17 July 2009
ER -