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A Temperature Prediction Model of T-type Inverter Module Based on Multi-Physics Coupling

  • Jianpeng Wang
  • , Zhiyuan Qi
  • , Yuqi Duan
  • , Laili Wang
  • , Cheng Zhao
  • , Fengtao Yang
  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

A new accurate internal temperature prediction model of T-type inverter module is proposed, considering the electro-thermal coupling effect and the correction of the boundary conditions in the finite element analysis. With high accuracy and reliability, it has a good application prospect using to study the influence of multiple physical fields on the junction temperature in actual operation. In this paper, power loss analysis is first presented based on the T-type power module topology. Then the steady-state and dynamic prediction models of the junction temperature is demonstrated based on the finite-element method (FEM) and the Cauer and Foster thermal-impedance, respectively. Finally, simulation results are provided to verify the accuracy of temperature prediction of the two thermal models.

源语言英语
主期刊名Proceedings - 2018 IEEE International Power Electronics and Application Conference and Exposition, PEAC 2018
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781538660539
DOI
出版状态已出版 - 26 12月 2018
活动2018 IEEE International Power Electronics and Application Conference and Exposition, PEAC 2018 - Shenzhen, 中国
期限: 4 11月 20187 11月 2018

出版系列

姓名Proceedings - 2018 IEEE International Power Electronics and Application Conference and Exposition, PEAC 2018

会议

会议2018 IEEE International Power Electronics and Application Conference and Exposition, PEAC 2018
国家/地区中国
Shenzhen
时期4/11/187/11/18

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