A study on surface modification of soluble block copolymer polyimide by UV irradiation and its application to electroless plating

In this paper, the influence of UV irradiation on surface properties of soluble block copolymer polyimide (SBC-PI) was investigated. The changes of topological and chemical properties of SBC-PI were investigated through water droplets test, dynamic force microscope (DFM) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. Analysis results revealed that the surface properties of UV-irradiated SBC-PI film were changes from hydrophobic to hydrophilic without the increase of surface roughness, as a result from the generation of hydrophilic group. Through subsequent Cu electroless plating on selectively modified SBC-PI film, it was also demonstrated that the amount of electroplated Cu could be controlled by varying UV irradiation dose.