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A Single-input Dual-output Three-level Buck Converter for SoC Applications

  • Zhuoneng Li
  • , Zhonamina Xue
  • , Chenalona Liang
  • , Yongchao Zhang
  • , Mengqi Duan
  • , Shangzhou Zhao
  • , Xihao Liu
  • , Zhuoqi Guo
  • , Li Geng
  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

摘要

This paper proposes a single-input dual-output (SIDO) three-level buck converter to meet the requirements of multi-voltage domain and high voltage stress for SoC applications. The topology is based on three-level buck with standard 1.8V devices, where only an additional power switch is added. By using this structure, the second output can be powered by a fly capacitor, and VCF calibration is achieved by the control loop for reliability issues. Hence the efficiency and the power density are enhanced with standard devices and reducing the number of power switches. Moreover, the control loop with error processor and driver module is demonstrated based on the topology analysis. Ultimately, the proposed converter is designed and fabricated with 0.18μm CMOS process, which handles the input range of 3.3-2.8V and dual-output of 1.8V and 1.2V with 96.9% peak efficiency. The power density is 2.557W/mm2, and the active area is only 0.49 mm2.

源语言英语
主期刊名Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022
出版商Institute of Electrical and Electronics Engineers Inc.
127-128
页数2
ISBN(电子版)9781665492690
DOI
出版状态已出版 - 2022
活动2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022 - Xi'an, 中国
期限: 28 10月 202230 10月 2022

出版系列

姓名Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022

会议

会议2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022
国家/地区中国
Xi'an
时期28/10/2230/10/22

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