TY - GEN
T1 - A PMUT-based Ultrasonic Probe Used for Contact Force Sensing
AU - Xu, Tingzhong
AU - Zhao, Libo
AU - Li, Zixuan
AU - Yuan, Jiawei
AU - Zhao, Yihe
AU - Luo, Guoxi
AU - Li, Jie
AU - Li, Zhiakang
AU - Yang, Ping
AU - Jiang, Zhuangde
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/1/25
Y1 - 2021/1/25
N2 - This work conducts systematic research on the design, optimization and application of piezoelectric micromachined ultrasonic transducers (PMUT) based ultrasonic probe. And it is the first time for PMUT used in contact force sensing. The PMUT chip consists of a pair of concentrically aligned circular and annular arrays used for receiving and emitting ultrasound, respectively. It achieves an emitting sensitivity of 1200 Pa/V. And the analytical model results achieve a good agreement with the experimental results, which only have relative errors of 8.8% and 6.3% in central working frequency and fractional bandwidth, respectively. Finally, an application experiment is carried out for contact force sensing, which achieves a maximum measuring sensitivity of -111 N/dB.
AB - This work conducts systematic research on the design, optimization and application of piezoelectric micromachined ultrasonic transducers (PMUT) based ultrasonic probe. And it is the first time for PMUT used in contact force sensing. The PMUT chip consists of a pair of concentrically aligned circular and annular arrays used for receiving and emitting ultrasound, respectively. It achieves an emitting sensitivity of 1200 Pa/V. And the analytical model results achieve a good agreement with the experimental results, which only have relative errors of 8.8% and 6.3% in central working frequency and fractional bandwidth, respectively. Finally, an application experiment is carried out for contact force sensing, which achieves a maximum measuring sensitivity of -111 N/dB.
KW - array
KW - contact force sensing.
KW - piezoelectric micromachined ultrasonic transducer
KW - ultrasonic probe
UR - https://www.scopus.com/pages/publications/85103462855
U2 - 10.1109/MEMS51782.2021.9375405
DO - 10.1109/MEMS51782.2021.9375405
M3 - 会议稿件
AN - SCOPUS:85103462855
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 419
EP - 422
BT - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Y2 - 25 January 2021 through 29 January 2021
ER -