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A novel self-sensitive SFM for nondestructive measurement of tiny vertical surfaces with restricted access

  • T. Kobayashi
  • , X. C. Shan
  • , Y. Murakoshi
  • , R. Maeda
  • National Institute of Advanced Industrial Science and Technology
  • Agency for Science, Technology and Research, Singapore

科研成果: 书/报告/会议事项章节会议稿件同行评审

6 引用 (Scopus)

摘要

This paper presents a novel scanning force microscope (SFM) for the nondestructive measurement of tiny micromachined vertical surfaces, which conventional SFMs or other instruments cannot access without destruction. In addition to its access flexibility, our SFM uses the self-sensitive cantilever for sensing its own deflections. As a result, it can access tiny areas and restricted locations for measuring the features of microstructures; for example, the surfaces of a tiny vertical reflecting mirror, the inside walls of a small hole and the inner surfaces of a micro mold insert. The SFM has been successfully used in evaluating the vertical reflecting surfaces of silicon mirrors, the side walls of cavities in a micro mold and the vertical reflecting surfaces of embossed polymer mirrors with a dimension of 500 μm long x 100 μm wide x 200 μm deep (high). In this paper, details of the design and instrumentation of our SFM, and how it is used for monitoring the process for fabricating a polymer-based optical switch will be presented.

源语言英语
主期刊名DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003
编辑Bernard Courtois, Jean Michel Karam, Jan Korvink, Karen Markus, Keren Bergman, Bernd Michel
出版商Institute of Electrical and Electronics Engineers Inc.
286-289
页数4
ISBN(电子版)078037066X, 9780780370661
DOI
出版状态已出版 - 2003
已对外发布
活动5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, DTIP 2003 - Cannes, 法国
期限: 5 5月 20037 5月 2003

丛书

姓名DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

会议

会议5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, DTIP 2003
国家/地区法国
Cannes
时期5/05/037/05/03

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