TY - GEN
T1 - A Novel Resonant Accelerometer Based on Quartz on Silicon (QoS)
AU - Han, Chao
AU - Zhao, Yulong
AU - Li, Cun
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - a novel way to fabricate quartz resonant accelerometer is proposed in this paper, which mainly includes Quartz on Silicon (QoS) technology and Inductively Coupled Plasma (ICP) etching. The QoS method can fabricate ultra-thin quartz wafer on silicon, so that the quartz layer can be easily etched by ICP dry etching for replacing conventional fluoride-based wet etching. Based on the proposed fabrication method, a quartz micro accelerometer with micro-leverage mechanism amplifying the inertial force is designed, simulated and fabricated. A link beam is designed between micro-leverage and DETF to make a single micro-leverage effective in DETF, which can concentrate and distribute stress into two DETF beams for making their axial stress basically same. The simulation sensitivity of the accelerometer is 31.88 Hz/g with the amplification of micro-leverage.
AB - a novel way to fabricate quartz resonant accelerometer is proposed in this paper, which mainly includes Quartz on Silicon (QoS) technology and Inductively Coupled Plasma (ICP) etching. The QoS method can fabricate ultra-thin quartz wafer on silicon, so that the quartz layer can be easily etched by ICP dry etching for replacing conventional fluoride-based wet etching. Based on the proposed fabrication method, a quartz micro accelerometer with micro-leverage mechanism amplifying the inertial force is designed, simulated and fabricated. A link beam is designed between micro-leverage and DETF to make a single micro-leverage effective in DETF, which can concentrate and distribute stress into two DETF beams for making their axial stress basically same. The simulation sensitivity of the accelerometer is 31.88 Hz/g with the amplification of micro-leverage.
KW - bonding
KW - micro-leverage
KW - quartz on silicon
KW - resonant accelerometer
KW - thinning and polishing
UR - https://www.scopus.com/pages/publications/85068599440
U2 - 10.1109/ISISS.2019.8739634
DO - 10.1109/ISISS.2019.8739634
M3 - 会议稿件
AN - SCOPUS:85068599440
T3 - INERTIAL 2019 - 6th IEEE International Symposium on Inertial Sensors and Systems, Proceedings
BT - INERTIAL 2019 - 6th IEEE International Symposium on Inertial Sensors and Systems, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th IEEE International Symposium on Inertial Sensors and Systems, INERTIAL 2019
Y2 - 1 April 2019 through 5 April 2019
ER -