TY - GEN
T1 - A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SiC Power Module
AU - Yang, Fengtao
AU - Wang, Laili
AU - Wang, Jianpeng
AU - Zhao, Cheng
AU - Qi, Zhiyuan
AU - Chen, Yang
AU - Zhang, Yang
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5
Y1 - 2018/5
N2 - In this paper, a novel packaging method which features wirebond-less structure by using flexible printed circuit board (FPCB) are presented. Detailed comparisons are also conducted with the wirebonding hybrid packaging structure in a half-bridge (HB) module. The results reveal the better performances of the FPCB packaging method in smaller parasitic inductances, less switching losses, better thermal stability. Compared with the wirebonding packaging structure, the parasitic inductances in power loop and gate loop decrease by 52% and 76% respectively. The double pulse test (DPT) was established in simulation to compare the switching losses which decreases by 22% relatively. Furthermore, the simulation is conducted by Finite Element Analysis (FEA), and the temperature of the FPCB structure decreases by 20°C. This paper also focuses on the reliability of solder layer between FPCB and DBC substrate. In general, it clearly manifests that, the FPCB packaging structure has smaller parasitic inductances, better thermal performance and reliability.
AB - In this paper, a novel packaging method which features wirebond-less structure by using flexible printed circuit board (FPCB) are presented. Detailed comparisons are also conducted with the wirebonding hybrid packaging structure in a half-bridge (HB) module. The results reveal the better performances of the FPCB packaging method in smaller parasitic inductances, less switching losses, better thermal stability. Compared with the wirebonding packaging structure, the parasitic inductances in power loop and gate loop decrease by 52% and 76% respectively. The double pulse test (DPT) was established in simulation to compare the switching losses which decreases by 22% relatively. Furthermore, the simulation is conducted by Finite Element Analysis (FEA), and the temperature of the FPCB structure decreases by 20°C. This paper also focuses on the reliability of solder layer between FPCB and DBC substrate. In general, it clearly manifests that, the FPCB packaging structure has smaller parasitic inductances, better thermal performance and reliability.
KW - half-bridge (HB) module
KW - high frequency
KW - high power density
KW - hybird packaging
KW - power electronics
KW - silicon carbide (SiC)
KW - wide bandgap (WBG) device
UR - https://www.scopus.com/pages/publications/85068330904
U2 - 10.1109/WiPDAAsia.2018.8734651
DO - 10.1109/WiPDAAsia.2018.8734651
M3 - 会议稿件
AN - SCOPUS:85068330904
T3 - 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018
SP - 48
EP - 53
BT - 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018
Y2 - 16 May 2018 through 18 May 2018
ER -