A novel overlay process for imprint lithography using load release and alignment error pre-compensation method

As a low-cost and high-efficiency alternative to conventional photolithography, imprint lithography has been paid serious attention for it can realize the pattern transfer easily and repeatedly. Even so, there is still a long way to go before this technique can be used to manufacture ICs since the layer-to-layer alignment is a main obstacle. In this paper, the pattern distortion and position shift induced by loading force and friction force are investigated and an optimized process is proposed to realize high precision overlay, in which an optimal loading force and a load release and an alignment error pre-compensation (LRAEPC) method are adopted. The optimal loading force is acquired by comparing the variety trends of the residual layer and position shift with the loading force. Using the optimal loading force, transferred patterns with proper resist thickness and the minimal distortion are achieved. In LRAEPC method, load release is used to correct the pattern distortion and to alleviate the position shift. To avoid subsequent position adjustment in the fluid after load release, the pre-compensation alignment is performed before the mold is in contact with the wafer. This process does not locate correct alignment position and there is an alignment compensation value determined by the statistical data of alignment position shift after load release. Using this pre-compensation alignment method, the correct alignment can be obtained after load release.