A novel high performance flat-evaporator loop heat pipe coupled with dual micro vapor-driven jet injectors

Under the rapid development of information technology, the miniaturization and integration of high-performance electronics is posing critical challenges for thermal management systems. As an efficient passive phase-change cooling device, flat-evaporator loop heat pipes (FLHPs) show significant potential in cooling systems of high-heat-flux electronics. However, conventional FLHPs face dual constraints of capillary limits and dry-out phenomenon, resulting in difficult to meet the demands of high-heat-flux electronics. This work proposed a novel FLHP configuration with dual injectors (LHPDI) and experimentally confirmed the feasibility. To address capillary limits in conventional loose sintered wicks under medium-high heat loads, a pressurized bi-porous integrated wick was developed. The maximum capillary force was enhanced by 71.4 %. To avoid the dry-out phenomenon under high heat loads caused by the vapor flow obstruction and liquid return delay, the dual injectors were adopted to enlarge the flow area of vapor line and enhance fluid circulation. Experimental results revealed that the maximum vapor pressure was decreased by 31 % compared to single-injector configuration. Simultaneously, the operating temperature decreased by 6.5–25.6 °C and the total thermal resistance was reduced by 20.6 %. The critical dry-out heat load reached 1059 W (heat flux 88.3 W/cm²), with a minimum thermal resistance of 0.115 K/W. The remaining heat leakage was reduced to below 1 %. For cooling ordinary industrial electronics, the novel LHPDI increased the maximum heat load and heat flux by 102 % and 90.2 %, respectively, without raising cooling energy consumption.