TY - GEN
T1 - A MEMS accelerometer based on synchronizing DETF oscillators
AU - Wang, Shudong
AU - Pu, Dong
AU - Huan, Ronghua
AU - Jiang, Zhuangde
AU - Shen, Yajing
AU - Wei, Xueyong
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - In this abstract, a novel MEMS resonant accelerometer based on synchronized double-ended tuning fork (DETF) oscillators is reported. Synchronization is recently proved to enhance the stability of coupled MEMS oscillators. In this report, synchronization was utilized to improve the performance of the resonant accelerometer. In the experimental evaluation, scale factor of the sensor proposed was 1056Hz/g. Through synchronization, the zero-bias instability of the oscillator was improved to 98ppb in an integration time of 1s, which is 2 times better than before. This design demonstrates the feasibility of resonant sensors based on synchronizing DETF oscillators and provides a new method in improving their performance.
AB - In this abstract, a novel MEMS resonant accelerometer based on synchronized double-ended tuning fork (DETF) oscillators is reported. Synchronization is recently proved to enhance the stability of coupled MEMS oscillators. In this report, synchronization was utilized to improve the performance of the resonant accelerometer. In the experimental evaluation, scale factor of the sensor proposed was 1056Hz/g. Through synchronization, the zero-bias instability of the oscillator was improved to 98ppb in an integration time of 1s, which is 2 times better than before. This design demonstrates the feasibility of resonant sensors based on synchronizing DETF oscillators and provides a new method in improving their performance.
UR - https://www.scopus.com/pages/publications/85074335880
U2 - 10.1109/MEMSYS.2019.8870824
DO - 10.1109/MEMSYS.2019.8870824
M3 - 会议稿件
AN - SCOPUS:85074335880
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 660
EP - 663
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -