TY - JOUR
T1 - A larger nonvolatile bipolar resistive switching memory behaviour fabricated using eggshells
AU - Zhou, Guangdong
AU - Sun, Bai
AU - Zhou, Ankun
AU - Wu, Bo
AU - Huang, Haishen
N1 - Publisher Copyright:
© 2016 Elsevier B.V.
PY - 2017/2/1
Y1 - 2017/2/1
N2 - Resistive random access memory (RRAM) devices have emerged as promising candidates for near future nonvolatile information storage. Eggshells, a food waste, have not been focused and recycled sustainably today. Eggshell-based devices have shown a large resistive-switching(RS) memory behaviors with favorable resistance ratio of ∼103, larger memory window of ∼3.5 V, and high endurance and retention performance. Redox-based Ag filament models involving the formation and rupture of the metallic conduction filaments between top and bottom electrodes are proposed to interpret the large nonvolatile bipolar RS memory behaviors. This discovery provides for the possibility of an environmentally friendly, low-cost and sustainable material application in the next-generation nonvolatile date storage device.
AB - Resistive random access memory (RRAM) devices have emerged as promising candidates for near future nonvolatile information storage. Eggshells, a food waste, have not been focused and recycled sustainably today. Eggshell-based devices have shown a large resistive-switching(RS) memory behaviors with favorable resistance ratio of ∼103, larger memory window of ∼3.5 V, and high endurance and retention performance. Redox-based Ag filament models involving the formation and rupture of the metallic conduction filaments between top and bottom electrodes are proposed to interpret the large nonvolatile bipolar RS memory behaviors. This discovery provides for the possibility of an environmentally friendly, low-cost and sustainable material application in the next-generation nonvolatile date storage device.
KW - Eggshell dielectric films
KW - Redox-based filaments
KW - Resistive switching memory
UR - https://www.scopus.com/pages/publications/85000968653
U2 - 10.1016/j.cap.2016.09.018
DO - 10.1016/j.cap.2016.09.018
M3 - 文章
AN - SCOPUS:85000968653
SN - 1567-1739
VL - 17
SP - 235
EP - 239
JO - Current Applied Physics
JF - Current Applied Physics
IS - 2
ER -