@inproceedings{c5dc0df9613642aa9518404f6505162d,
title = "A 3D stacked step-down intergrated power module",
abstract = "This paper presents a 3D integrated power module design to effectively save footprint and improve thermal performance. The design reduces the footprint by 40\% using a 3D structure in which the inductor is over the top of the regulator. A fixed inductor with a cavity is used to envelop the 3D power module, and the high thermal conductivity of the magnetic core significantly enhances heat dissipation. An efficiency-wise design is applied to the proposed power module and there is a reduction in inductor DC resistance, which can in turn further improve the thermal performance. An analytical thermal model is built to calculate the temperature, 3D FEA (Finite Element Analysis) simulation is also utilized to estimate the improvement in temperature field. A prototype is built to test the electrical and thermal performances as well. The DCR is reduced by more than 30\% and the thermal performance is improved by 8-10°C compared with plastic molded power modules.",
keywords = "3D power module, FEA simulation, Intergrated inductor, Thermal analysis",
author = "Wenbo Liu and Liu, \{Yan Fei\} and Laili Wang and Doug Malcolm",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 ; Conference date: 26-03-2017 Through 30-03-2017",
year = "2017",
month = may,
day = "17",
doi = "10.1109/APEC.2017.7930802",
language = "英语",
series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "890--897",
booktitle = "2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017",
}