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A 200-Gb/s Low-Noise TIA in 28-nm CMOS

  • Feiyang Zhang
  • , Jianyu Yang
  • , Yifei Xia
  • , Zhixing Zhang
  • , Ruixuan Yang
  • , Liang Zhao
  • , Wenxin Zhang
  • , Cailing Li
  • , Zetong Zhang
  • , Shenlei Bao
  • , Binhao Wang
  • , Li Geng
  • , Dan Li
  • Xi'an Jiaotong University
  • CAS - Xi'an Institute of Optics and Precision Mechanics
  • University of Chinese Academy of Sciences

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

This paper presents a 200-Gb/s low-noise transimpedance amplifier (TIA) implemented in standard 28-nm CMOS technology, addressing the escalating bandwidth demands of artificial intelligence data centers (AIDCs). The proposed TIA employs a three-stage front-end with a inductive peaking strategy, a single-to-differential equalizer (S2D-EQ), and a linear CML output buffer for signal performance. The TIA achieves transimpedance gain of 61.6 dBΩ, an O-E bandwidth of 48 GHz, and an input-referred noise density of 11.5 pA/√Hz while consuming 116 mW (0.58 pJ/bit). The TIA supports 100-GBaud PAM-4 modulation, validating its suitability for nextgeneration high-density optical communication systems.

源语言英语
主期刊名2026 IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2026
出版商Institute of Electrical and Electronics Engineers Inc.
页315-318
页数4
ISBN(电子版)9798319518033
DOI
出版状态已出版 - 2026
活动2026 IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2026 - Boston, 美国
期限: 7 6月 2026 → 9 6月 2026

丛书

姓名Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium
ISSN(印刷版)1529-2517

会议

会议2026 IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2026
国家/地区美国
市Boston
时期7/06/26 → 9/06/26

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