摘要
With the advancement of flexible direct current (DC) transmission technology, high-voltage DC circuit breakers demand higher arc erosion resistance and arc-extinguishing gas corrosion resistance. Copper-tungsten materials are widely employed as contact materials for their exceptional comprehensive properties, and their performance directly affects the operational safety of gas-insulated circuit breaker systems. In this study, first-principles calculations were used to investigate the SF6-induced corrosion behavior of different W/Cu surface and interface structures under DC conditions. Results show that the work function of W/Cu is structure-dependent, with the lowest value (4.28 eV) at the copper-tungsten grain boundary. SF6 adsorbs more strongly on the W phase (adsorption energy: −1.17 eV), while the lowest adsorption energy (−5.80 eV) occurs at the copper-tungsten grain boundary; notably, anodic and cathodic environments significantly affect the adsorption and corrosion processes. After corrosion, both the work function and maximum stress of copper-tungsten decreased by 7%. This study offers theoretical support for designing high-performance copper-tungsten contact materials for high-voltage DC circuit breakers.
| 投稿的翻译标题 | Investigation on the corrosion mechanism of W/Cu surfaces and interfaces induced by SF6 under DC arc discharge |
|---|---|
| 源语言 | 繁体中文 |
| 文章编号 | 240020 |
| 期刊 | Scientia Sinica: Physica, Mechanica et Astronomica |
| 卷 | 56 |
| 期 | 4 |
| DOI | |
| 出版状态 | 已出版 - 1 4月 2026 |
关键词
- corrosion mechanism
- Cu-W contact
- first principles
学术指纹
探究 '直流燃弧下铜钨表界面SF6腐蚀机理研究' 的科研主题。它们共同构成独一无二的指纹。引用此
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