XPS Analysis of SiC Films Prepared by Radio Frequency Plasma Sputtering

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Abstract

SiC films were deposited by radio frequency (r.f.) plasma sputtering (SPF-312H) on Ti6Al4 V substrate with a pre-deposited Cr bond layer. The effects of sputtering parameters on the microstructure and the chemical bonds of the SiC films were investigated using X-ray photoelectron spectroscope (XPS, Perkin Elmer ESCA5600), atomic force microscopy (AFM, HITACHI WAO200), scanning electronic microscopy (SEM, JEOL JSM-5310) and X-ray diffraction (XRD RIGAKU RINT 2000/PC). The Vickers microhardness of the films was examined by a microhardness tester (MVK-H2) equipped a microscope with a magnification of 1000 at 25 gf loads. It was found that the sputtered Si-C films are amorphous on Ti6Al4 V under the present deposition conditions. According to XPS analysis, the films almost consist of higher energy C-Si bonds under the higher power and lower chamber pressure. The bond structure hypothesis is well consistent with our previously achieved experimental observations concerning the evolution of surface roughness and microhardness with varying the sputtering power and chamber pressure.

Original languageEnglish
Title of host publication18th International Vacuum Congress, IVC 2010
EditorsFeng Pan, Xu Chen
PublisherElsevier B.V.
Pages95-102
Number of pages8
ISBN (Electronic)9781627487481
DOIs
StatePublished - 2012
Event18th International Vacuum Congress, IVC 2010 - Beijing, China
Duration: 23 Aug 201027 Aug 2010

Publication series

NamePhysics Procedia
Volume32
ISSN (Print)1875-3884
ISSN (Electronic)1875-3892

Conference

Conference18th International Vacuum Congress, IVC 2010
Country/TerritoryChina
CityBeijing
Period23/08/1027/08/10

Keywords

  • Chemical bond
  • Film
  • Radio frequency plasma sputtering
  • SiC
  • XPS

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