TY - GEN
T1 - Understanding the Thermal and Resistive Properties from the Perspective of Molecular Interaction of Epoxy/POSS Composite
AU - Aslam, Farooq
AU - Li, Zhen
AU - Qu, Guanghao
AU - Zhang, Zhaozi
AU - Niu, Huan
AU - Li, Shengtao
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/11
Y1 - 2021/4/11
N2 - Molecular interaction among different functional groups of insulating polymers manipulates the thermal and electrical properties. Two types of polyhedral oligomeric silsesquioxane (POSS) are added to epoxy and the outcome is studied by thermal conductivity, differential scanning calorimetry, and volume resistivity. A molecular dynamic simulation was set out using Material Studio 2017 software to investigate the intermolecular interaction mechanism that influences the thermal and electrical properties. The results show that doping epoxycyclohexyl POSS (ECH-POSS) with epoxy enhances the thermal conductivity, while glass transition temperature (Tg) is lowered compared to octa glycidyl POSS (OG POSS) doped epoxy composite and higher than pristine epoxy. Moreover, blending OG-POSS with epoxy demonstrates a positive impact on thermal conductivity and volume resistivity, which is attributed to the functionality of side groups. From the molecular simulations, the molecular interaction energy of EP/OG-POSS composites synergistically improves the thermal and electrical properties. In the last, the steric hindrance effect of POSS side chains is argued and the modified properties of epoxy/POSS composite are associated to the crosslinking brought by the side groups of POSS.
AB - Molecular interaction among different functional groups of insulating polymers manipulates the thermal and electrical properties. Two types of polyhedral oligomeric silsesquioxane (POSS) are added to epoxy and the outcome is studied by thermal conductivity, differential scanning calorimetry, and volume resistivity. A molecular dynamic simulation was set out using Material Studio 2017 software to investigate the intermolecular interaction mechanism that influences the thermal and electrical properties. The results show that doping epoxycyclohexyl POSS (ECH-POSS) with epoxy enhances the thermal conductivity, while glass transition temperature (Tg) is lowered compared to octa glycidyl POSS (OG POSS) doped epoxy composite and higher than pristine epoxy. Moreover, blending OG-POSS with epoxy demonstrates a positive impact on thermal conductivity and volume resistivity, which is attributed to the functionality of side groups. From the molecular simulations, the molecular interaction energy of EP/OG-POSS composites synergistically improves the thermal and electrical properties. In the last, the steric hindrance effect of POSS side chains is argued and the modified properties of epoxy/POSS composite are associated to the crosslinking brought by the side groups of POSS.
KW - POSS
KW - electrical insulation
KW - epoxy
KW - glass transition temperature
KW - molecular dynamics
KW - thermal conductivity
UR - https://www.scopus.com/pages/publications/85114031673
U2 - 10.1109/ICEMPE51623.2021.9509172
DO - 10.1109/ICEMPE51623.2021.9509172
M3 - 会议稿件
AN - SCOPUS:85114031673
T3 - ICEMPE 2021 - 3rd International Conference on Electrical Materials and Power Equipment
BT - ICEMPE 2021 - 3rd International Conference on Electrical Materials and Power Equipment
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Electrical Materials and Power Equipment, ICEMPE 2021
Y2 - 11 April 2021 through 15 April 2021
ER -