Understanding temperature impact on filament-related HfO2 solid-state incandescent lighting emission devices and performance enhancement using patterned wafer approaches

Yiwei Liu; Gang Niu; Can Yang; Shengli Wu; Liyan Dai; Oliver Skibitzki

doi:10.1109/LED.2019.2899878

Understanding temperature impact on filament-related HfO₂ solid-state incandescent lighting emission devices and performance enhancement using patterned wafer approaches

Yiwei Liu
, Gang Niu
, Can Yang
, Shengli Wu
, Liyan Dai
, Oliver Skibitzki

Faculty of Electronic and Information Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

HfO₂-based solid-state incandescent light emission devices (SSI-LEDs) with conductive filament-related light emission mechanism are promising candidates for future light emission devices. In this letter, the temperature impact on the electrical and light emission properties of SSI-LEDs has been studied. The increase of the substrate temperature of the device leads to a reduction of the hard breakdown voltage and a decrease of the lighting efficiency. Both behaviors can be attributed to the Si-diffusion-assisted filament mechanism. By understanding such mechanism, we demonstrate a patterned wafer approach, geometrically confining the electrical field to effectively enhance the lighting performance of HfO₂ SSI-LED devices. Our results support the explanation of the underlying light mechanism and open an effective pathway to improve the performance of the SSI-LED devices.

Original language	English
Article number	8643444
Pages (from-to)	582-585
Number of pages	4
Journal	IEEE Electron Device Letters
Volume	40
Issue number	4
DOIs	https://doi.org/10.1109/LED.2019.2899878
State	Published - Apr 2019

Keywords

HfO
patterned wafer
substrate temperature

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10.1109/LED.2019.2899878

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@article{716fb5d9c8384ab29924237f27fa0958,

title = "Understanding temperature impact on filament-related HfO2 solid-state incandescent lighting emission devices and performance enhancement using patterned wafer approaches",

abstract = "HfO2-based solid-state incandescent light emission devices (SSI-LEDs) with conductive filament-related light emission mechanism are promising candidates for future light emission devices. In this letter, the temperature impact on the electrical and light emission properties of SSI-LEDs has been studied. The increase of the substrate temperature of the device leads to a reduction of the hard breakdown voltage and a decrease of the lighting efficiency. Both behaviors can be attributed to the Si-diffusion-assisted filament mechanism. By understanding such mechanism, we demonstrate a patterned wafer approach, geometrically confining the electrical field to effectively enhance the lighting performance of HfO2 SSI-LED devices. Our results support the explanation of the underlying light mechanism and open an effective pathway to improve the performance of the SSI-LED devices.",

keywords = "HfO, patterned wafer, substrate temperature",

author = "Yiwei Liu and Gang Niu and Can Yang and Shengli Wu and Liyan Dai and Oliver Skibitzki",

note = "Publisher Copyright: {\textcopyright} 1980-2012 IEEE.",

year = "2019",

month = apr,

doi = "10.1109/LED.2019.2899878",

language = "英语",

volume = "40",

pages = "582--585",

journal = "IEEE Electron Device Letters",

issn = "0741-3106",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Understanding temperature impact on filament-related HfO2 solid-state incandescent lighting emission devices and performance enhancement using patterned wafer approaches

AU - Liu, Yiwei

AU - Niu, Gang

AU - Yang, Can

AU - Wu, Shengli

AU - Dai, Liyan

AU - Skibitzki, Oliver

PY - 2019/4

Y1 - 2019/4

N2 - HfO2-based solid-state incandescent light emission devices (SSI-LEDs) with conductive filament-related light emission mechanism are promising candidates for future light emission devices. In this letter, the temperature impact on the electrical and light emission properties of SSI-LEDs has been studied. The increase of the substrate temperature of the device leads to a reduction of the hard breakdown voltage and a decrease of the lighting efficiency. Both behaviors can be attributed to the Si-diffusion-assisted filament mechanism. By understanding such mechanism, we demonstrate a patterned wafer approach, geometrically confining the electrical field to effectively enhance the lighting performance of HfO2 SSI-LED devices. Our results support the explanation of the underlying light mechanism and open an effective pathway to improve the performance of the SSI-LED devices.

AB - HfO2-based solid-state incandescent light emission devices (SSI-LEDs) with conductive filament-related light emission mechanism are promising candidates for future light emission devices. In this letter, the temperature impact on the electrical and light emission properties of SSI-LEDs has been studied. The increase of the substrate temperature of the device leads to a reduction of the hard breakdown voltage and a decrease of the lighting efficiency. Both behaviors can be attributed to the Si-diffusion-assisted filament mechanism. By understanding such mechanism, we demonstrate a patterned wafer approach, geometrically confining the electrical field to effectively enhance the lighting performance of HfO2 SSI-LED devices. Our results support the explanation of the underlying light mechanism and open an effective pathway to improve the performance of the SSI-LED devices.

KW - HfO

KW - patterned wafer

KW - substrate temperature

UR - https://www.scopus.com/pages/publications/85064069386

U2 - 10.1109/LED.2019.2899878

DO - 10.1109/LED.2019.2899878

M3 - 文章

AN - SCOPUS:85064069386

SN - 0741-3106

VL - 40

SP - 582

EP - 585

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

IS - 4

M1 - 8643444

ER -

Understanding temperature impact on filament-related HfO₂ solid-state incandescent lighting emission devices and performance enhancement using patterned wafer approaches

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Keywords

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