Tuning the thermal conductivity of multi-layer graphene with interlayer bonding and tensile strain

  • Taiyu Guo
  • , Zhen Dong Sha
  • , Xiangjun Liu
  • , Gang Zhang
  • , Tianfu Guo
  • , Qing Xiang Pei
  • , Yong Wei Zhang

Research output: Contribution to journalArticlepeer-review

39 Scopus citations

Abstract

We investigate the thermal conductivity of interlayer-bonded bilayer graphene, trilayer graphene, and pyrolytic graphite using molecular dynamics simulations. We find that interlayer sp3 bonding greatly reduces the thermal conductivity, with the reduction up to 80 %, depending on the distribution and coverage of sp3 bonds. Besides, we find that tensile strain reduces the thermal conductivity of interlayer-bonded graphene further by up to 50 %. Our findings suggest the possibility of using interlayer sp3 bonds and tensile strain to tune and manipulate the thermal conductivity of multi-layer graphene, which may be useful in thermal management of graphene-based nanodevices and in thermoelectric applications of graphene.

Original languageEnglish
Pages (from-to)1275-1281
Number of pages7
JournalApplied Physics A: Materials Science and Processing
Volume120
Issue number4
DOIs
StatePublished - 18 Sep 2015

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