Abstract
We investigate the thermal conductivity of interlayer-bonded bilayer graphene, trilayer graphene, and pyrolytic graphite using molecular dynamics simulations. We find that interlayer sp3 bonding greatly reduces the thermal conductivity, with the reduction up to 80 %, depending on the distribution and coverage of sp3 bonds. Besides, we find that tensile strain reduces the thermal conductivity of interlayer-bonded graphene further by up to 50 %. Our findings suggest the possibility of using interlayer sp3 bonds and tensile strain to tune and manipulate the thermal conductivity of multi-layer graphene, which may be useful in thermal management of graphene-based nanodevices and in thermoelectric applications of graphene.
| Original language | English |
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| Pages (from-to) | 1275-1281 |
| Number of pages | 7 |
| Journal | Applied Physics A: Materials Science and Processing |
| Volume | 120 |
| Issue number | 4 |
| DOIs | |
| State | Published - 18 Sep 2015 |