Three-In-One Chip Designed for Wide Range Vacuum Sensing

Jingping Qiao; Ruiwenliu; Yanmei Kong; Binbin Jiao; Zhanqiang Hou; Feng Han; Shichang Yun; Yuxin Ye; Xangbin Du; Zilong Wang; Sibo Li

doi:10.1109/NEMS67320.2025.11169794

Three-In-One Chip Designed for Wide Range Vacuum Sensing

Jingping Qiao
, Ruiwenliu
, Yanmei Kong
, Binbin Jiao
, Zhanqiang Hou
, Feng Han
, Shichang Yun
, Yuxin Ye
, Xangbin Du
, Zilong Wang
, Sibo Li

Chinese Academy of Sciences
National University of Defense Technology
Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This is the first time that a MEMS piezoresistive low-vacuum sensitive structure, a MEMS Pirani mediumvacuum sensitive structure, and a MEMS resonant highvacuum sensitive structure were integrated and designed on a single chip. Wide-range and high-accuracy vacuum measurements can be realized by this integrated chip. To avoid mutual crosstalk between the three sensitive mechanisms leading to chip failure, thermal isolation, and electromagnetic shielding structures are designed to suppress thermal crosstalk and electromagnetic shielding crosstalk. Capable of vacuum measurement from high vacuum to atmospheric pressure.

Original language	English
Title of host publication	2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	288-291
Number of pages	4
ISBN (Electronic)	9798331599126
DOIs	https://doi.org/10.1109/NEMS67320.2025.11169794
State	Published - 2025
Externally published	Yes
Event	20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025 - Zhuhai, China Duration: 11 May 2025 → 14 May 2025

Publication series

Name	2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025

Conference

Conference	20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025
Country/Territory	China
City	Zhuhai
Period	11/05/25 → 14/05/25

Access to Document

10.1109/NEMS67320.2025.11169794

Cite this

Qiao, J., Ruiwenliu, Kong, Y., Jiao, B., Hou, Z., Han, F., Yun, S., Ye, Y., Du, X., Wang, Z., & Li, S. (2025). Three-In-One Chip Designed for Wide Range Vacuum Sensing. In 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025 (pp. 288-291). (2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS67320.2025.11169794

Qiao, Jingping ; Ruiwenliu ; Kong, Yanmei et al. / Three-In-One Chip Designed for Wide Range Vacuum Sensing. 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025. Institute of Electrical and Electronics Engineers Inc., 2025. pp. 288-291 (2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025).

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title = "Three-In-One Chip Designed for Wide Range Vacuum Sensing",

abstract = "This is the first time that a MEMS piezoresistive low-vacuum sensitive structure, a MEMS Pirani mediumvacuum sensitive structure, and a MEMS resonant highvacuum sensitive structure were integrated and designed on a single chip. Wide-range and high-accuracy vacuum measurements can be realized by this integrated chip. To avoid mutual crosstalk between the three sensitive mechanisms leading to chip failure, thermal isolation, and electromagnetic shielding structures are designed to suppress thermal crosstalk and electromagnetic shielding crosstalk. Capable of vacuum measurement from high vacuum to atmospheric pressure.",

author = "Jingping Qiao and Ruiwenliu and Yanmei Kong and Binbin Jiao and Zhanqiang Hou and Feng Han and Shichang Yun and Yuxin Ye and Xangbin Du and Zilong Wang and Sibo Li",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025 ; Conference date: 11-05-2025 Through 14-05-2025",

year = "2025",

doi = "10.1109/NEMS67320.2025.11169794",

language = "英语",

series = "2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "288--291",

booktitle = "2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025",

}

Qiao, J, Ruiwenliu, Kong, Y, Jiao, B, Hou, Z, Han, F, Yun, S, Ye, Y, Du, X, Wang, Z & Li, S 2025, Three-In-One Chip Designed for Wide Range Vacuum Sensing. in 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025. 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025, Institute of Electrical and Electronics Engineers Inc., pp. 288-291, 20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025, Zhuhai, China, 11/05/25. https://doi.org/10.1109/NEMS67320.2025.11169794

Three-In-One Chip Designed for Wide Range Vacuum Sensing. / Qiao, Jingping; Ruiwenliu; Kong, Yanmei et al.
2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025. Institute of Electrical and Electronics Engineers Inc., 2025. p. 288-291 (2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Three-In-One Chip Designed for Wide Range Vacuum Sensing

AU - Qiao, Jingping

AU - Ruiwenliu,

AU - Kong, Yanmei

AU - Jiao, Binbin

AU - Hou, Zhanqiang

AU - Han, Feng

AU - Yun, Shichang

AU - Ye, Yuxin

AU - Du, Xangbin

AU - Wang, Zilong

AU - Li, Sibo

PY - 2025

Y1 - 2025

N2 - This is the first time that a MEMS piezoresistive low-vacuum sensitive structure, a MEMS Pirani mediumvacuum sensitive structure, and a MEMS resonant highvacuum sensitive structure were integrated and designed on a single chip. Wide-range and high-accuracy vacuum measurements can be realized by this integrated chip. To avoid mutual crosstalk between the three sensitive mechanisms leading to chip failure, thermal isolation, and electromagnetic shielding structures are designed to suppress thermal crosstalk and electromagnetic shielding crosstalk. Capable of vacuum measurement from high vacuum to atmospheric pressure.

AB - This is the first time that a MEMS piezoresistive low-vacuum sensitive structure, a MEMS Pirani mediumvacuum sensitive structure, and a MEMS resonant highvacuum sensitive structure were integrated and designed on a single chip. Wide-range and high-accuracy vacuum measurements can be realized by this integrated chip. To avoid mutual crosstalk between the three sensitive mechanisms leading to chip failure, thermal isolation, and electromagnetic shielding structures are designed to suppress thermal crosstalk and electromagnetic shielding crosstalk. Capable of vacuum measurement from high vacuum to atmospheric pressure.

UR - https://www.scopus.com/pages/publications/105018745464

U2 - 10.1109/NEMS67320.2025.11169794

DO - 10.1109/NEMS67320.2025.11169794

M3 - 会议稿件

AN - SCOPUS:105018745464

T3 - 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025

SP - 288

EP - 291

BT - 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025

Y2 - 11 May 2025 through 14 May 2025

ER -

Qiao J, Ruiwenliu, Kong Y, Jiao B, Hou Z, Han F et al. Three-In-One Chip Designed for Wide Range Vacuum Sensing. In 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025. Institute of Electrical and Electronics Engineers Inc. 2025. p. 288-291. (2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025). doi: 10.1109/NEMS67320.2025.11169794

Three-In-One Chip Designed for Wide Range Vacuum Sensing

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