Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink

Pin fin microchannel heat sink is an excellent solution for enhancing the thermal dissipation for electronic devices with high integration and high-power density. The effect of the single crystal diamond (SCD) rhombus-shaped pin fin microchannel (RPFMC) heat sink with single-phase laminar fluid on the device heat transfer is investigated by three-dimensional numerical simulation, and geometrical parameters of the RPFMC heat sink are optimized and evaluated according to the performance evaluation criterion. The simulation results indicate that the thermal resistance of the device gets reduced by up to 81.6 % through using a SCD RPFMC heat sink instead of a silicon RPFMC heat sink with the same design, due to the superior thermal conductivity of SCD. Hotspot heat fluxes are evaluated to explore the tolerance of the SCD RPFMC heat sink which could withstand a heat flux of 2000 W/cm² with the temperature increased by only 17.3 K. Geometric design evaluation suggests that the SCD RPFMC heat sink with the rhombus-shaped pin fin angle of 75° and duty ratio of 0.4 has the optimal overall thermal performance.