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Three-dimensional integration of high frequency DC/DC converters based on LTCC technology

  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

15 Scopus citations

Abstract

This paper explores some strategies of incorporating advantages of low temperature co-fired ceramic (LTCC) technology into design and fabrication of low power high frequency DC/DC converters. High power density and high efficiency are two key factors for power modules. The development of new generation power switches with much less turn-on and turn-off time interval provides new chances for increasing switching frequency and reducing volume of passives, this makes LTCC technology which is commonly used in RF circuit applicable for fabrication and integration of high frequency DC/DC converters. Conductor paste, ceramic tapes, ferrite tapes, capacitor tapes as well as metal substrates are co-fired together to realize three-dimensional inter-connection, passive integration, thermal performance improvement and structure optimization.

Original languageEnglish
Title of host publication2009 IEEE 6th International Power Electronics and Motion Control Conference, IPEMC '09
Pages745-748
Number of pages4
DOIs
StatePublished - 2009
Event2009 IEEE 6th International Power Electronics and Motion Control Conference, IPEMC '09 - Wuhan, China
Duration: 17 May 200920 May 2009

Publication series

Name2009 IEEE 6th International Power Electronics and Motion Control Conference, IPEMC '09

Conference

Conference2009 IEEE 6th International Power Electronics and Motion Control Conference, IPEMC '09
Country/TerritoryChina
CityWuhan
Period17/05/0920/05/09

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