TY - GEN
T1 - Thermal properties of environmentally friendly dielectrics used in medium voltage circuit breakers
AU - Li, S.
AU - Hassanzadeh, M.
AU - James, I. R.
AU - Wang, W.
AU - Zhang, S.
AU - Li, J.
PY - 2007
Y1 - 2007
N2 - There is a need to replace an epoxy tie rod, which is used as the insulation and structural component within a vacuum circuit breaker, by an alternative environmentally friendly material. A selection process has demonstrated that glass filled thermoplastics are candidates. This paper compares the thermal performance using Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA) and Heat Distortion Temperature (HDT) of amorphous and semi-crystalline polymers with the epoxy thermoset as the reference. The outcome demonstrated that the higher glass filled semi-crystalline polymers were better but there was still thermo-mechanical instability within the morphology at the lower temperatures.
AB - There is a need to replace an epoxy tie rod, which is used as the insulation and structural component within a vacuum circuit breaker, by an alternative environmentally friendly material. A selection process has demonstrated that glass filled thermoplastics are candidates. This paper compares the thermal performance using Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA) and Heat Distortion Temperature (HDT) of amorphous and semi-crystalline polymers with the epoxy thermoset as the reference. The outcome demonstrated that the higher glass filled semi-crystalline polymers were better but there was still thermo-mechanical instability within the morphology at the lower temperatures.
UR - https://www.scopus.com/pages/publications/47349114685
U2 - 10.1109/ICSD.2007.4290813
DO - 10.1109/ICSD.2007.4290813
M3 - 会议稿件
AN - SCOPUS:47349114685
SN - 1424407516
SN - 9781424407514
T3 - 2007 International Conference on Solid Dielectrics, ICSD
SP - 306
EP - 309
BT - 2007 International Conference on Solid Dielectrics, ICSD
T2 - 2007 International Conference on Solid Dielectrics, ICSD
Y2 - 8 July 2007 through 13 July 2007
ER -