TY - GEN
T1 - Thermal performance of mini-scale heat sink with jet impingement and roughened surface
AU - Shen, Zhongyang
AU - Jing, Qi
AU - Xie, Yonghui
AU - Zhang, Di
N1 - Publisher Copyright:
© 2016 by ASME.
PY - 2016
Y1 - 2016
N2 - Cooling technique in mini-scale heat sink is essential with the development of high power electronics such as electronic chip. As heat transfer techniques, jet impingement cooling and convective cooling by roughened surface are commonly adopted. To obtain good cooling efficiency, the cooling structure within the heat sink should be carefully designed. In the present study, mini-scale heat sink with feature size of 1∼10 mm is set up. Arrangement of jet impingement and dimple/protrusion surface are designed as heat transfer augmentation approaches. The effect of dimple/protrusion configuration is discussed. From the result, the Nu distribution of on heat sink surface is demonstrated for each case. The pressure penalty due to the arrangement of roughened structure is evaluated. Also, thermal performance TP and performance evaluation plot are adopted as evaluations of cooling performance for each configuration. Comparing all cases, optimal cooling structure considering the energy saving performance is obtained for the mini-scale heat sink. Referencing the statistics, new insight has been provided for the design of cooling structure inside mini-scale heat sink.
AB - Cooling technique in mini-scale heat sink is essential with the development of high power electronics such as electronic chip. As heat transfer techniques, jet impingement cooling and convective cooling by roughened surface are commonly adopted. To obtain good cooling efficiency, the cooling structure within the heat sink should be carefully designed. In the present study, mini-scale heat sink with feature size of 1∼10 mm is set up. Arrangement of jet impingement and dimple/protrusion surface are designed as heat transfer augmentation approaches. The effect of dimple/protrusion configuration is discussed. From the result, the Nu distribution of on heat sink surface is demonstrated for each case. The pressure penalty due to the arrangement of roughened structure is evaluated. Also, thermal performance TP and performance evaluation plot are adopted as evaluations of cooling performance for each configuration. Comparing all cases, optimal cooling structure considering the energy saving performance is obtained for the mini-scale heat sink. Referencing the statistics, new insight has been provided for the design of cooling structure inside mini-scale heat sink.
UR - https://www.scopus.com/pages/publications/84969802772
U2 - 10.1115/MNHMT2016-6324
DO - 10.1115/MNHMT2016-6324
M3 - 会议稿件
AN - SCOPUS:84969802772
T3 - ASME 2016 5th International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2016
BT - Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters
PB - American Society of Mechanical Engineers
T2 - ASME 2016 5th International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2016
Y2 - 4 January 2016 through 6 January 2016
ER -