@inproceedings{4670473cef304a8eb8358a29f7a3ba6d,
title = "Thermal Evaporation of Different Copper Nanotip Structures under High Electric Field Based on Electrodynamics - Molecular Dynamics Simulations",
abstract = "As the miniaturization of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS) and molecular devices, the problem of vacuum insulation in the devices becomes more and more prominent. The nano-scale thermal effect caused by electron emission or dielectric breakdown under high electromagnetic field and local temperature, will lead to gasification and migration of the material in the device. In this work, the electrodynamics in the combination with discretized classic molecular dynamics method is used to simulate the thermal evaporation of nano-tips under high electric field. Cu nano-tips with different initial geometries and different electric fields are modeled using finite element methods to further analyze the deformation and damage mechanism of nano-tips under high electric field. Simulation results show that the length-diameter ratio of nano-tips have a significant influence on the atomic evaporation of nano-tips. The study is helpful to further explore the fundamental properties of vacuum breakdown at nano-scale.",
keywords = "Molecular Dynamics, field emission, high electric field, vacuum breakdown",
author = "Xinyu Gao and Bing Xiao and Ziang Jing and Nan Li and Qi Ying and Guodong Meng and Yonghong Cheng",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 ; Conference date: 20-10-2019 Through 23-10-2019",
year = "2019",
month = oct,
doi = "10.1109/CEIDP47102.2019.9009726",
language = "英语",
series = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "576--579",
booktitle = "2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings",
}