TY - GEN
T1 - Thermal Design via Improved Force-Directed Algorithm for IGCT Driver Board
AU - Gao, Xuming
AU - Zhang, Aimin
AU - Wang, Shan
AU - Du, Yudong
AU - Li, Ying
AU - Huang, Jingjing
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The power electronic device integrated gate commutated thyristor (IGCT) is currently being developed towards higher power density and reliability. As a crucial part of the IGCT, a highly integrated driver board is essential for the reliable turn-on and turn-off of the IGCT. However, thermal failure is the primary cause of failure for the IGCT driver board. Therefore, a reasonable thermal design of the driver board is imperative for the reliability of the IGCT. This paper proposes an improved force-directed algorithm suitable for the thermal layout of IGCT driver board components. Firstly, according to the requirements of the IGCT electrical characteristics, the driver board is divided into functional regions. Secondly, based on the size, adjacent spacing and heat flux gradient of the main heating components in each region, the displacement is iterated until the final layout results are output when the termination conditions are met. Finally, the simulation comparison results of the proposed and the traditional driver board show that the proposed algorithm can effectively improve the thermal performance of the IGCT driver board, realize the reasonable distribution of the overall temperature and reduce the local hot spot temperatures.
AB - The power electronic device integrated gate commutated thyristor (IGCT) is currently being developed towards higher power density and reliability. As a crucial part of the IGCT, a highly integrated driver board is essential for the reliable turn-on and turn-off of the IGCT. However, thermal failure is the primary cause of failure for the IGCT driver board. Therefore, a reasonable thermal design of the driver board is imperative for the reliability of the IGCT. This paper proposes an improved force-directed algorithm suitable for the thermal layout of IGCT driver board components. Firstly, according to the requirements of the IGCT electrical characteristics, the driver board is divided into functional regions. Secondly, based on the size, adjacent spacing and heat flux gradient of the main heating components in each region, the displacement is iterated until the final layout results are output when the termination conditions are met. Finally, the simulation comparison results of the proposed and the traditional driver board show that the proposed algorithm can effectively improve the thermal performance of the IGCT driver board, realize the reasonable distribution of the overall temperature and reduce the local hot spot temperatures.
KW - driver board
KW - force-directed algorithm
KW - functional regions division
KW - integrated gate commutated thyristor (IGCT)
KW - thermal layout
UR - https://www.scopus.com/pages/publications/85185810995
U2 - 10.1109/ETFG55873.2023.10407466
DO - 10.1109/ETFG55873.2023.10407466
M3 - 会议稿件
AN - SCOPUS:85185810995
T3 - 2023 IEEE International Conference on Energy Technologies for Future Grids, ETFG 2023
BT - 2023 IEEE International Conference on Energy Technologies for Future Grids, ETFG 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE International Conference on Energy Technologies for Future Grids, ETFG 2023
Y2 - 3 December 2023 through 6 December 2023
ER -
