TY - GEN
T1 - Thermal conductivity of double-wall carbon nanotube-polyanaline composites measured by a non-contact scanning hot probe technique
AU - Wilson, Adam A.
AU - Borca-Tasciuc, Theodorian
AU - Wang, Hong
AU - Yu, Choongho
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/25
Y1 - 2017/7/25
N2 - This paper presents a method for determining thermal conductivity of film samples using the non-contact mode scanning hot probe technique at probe-to-sample distances such that Fourier law heat conduction across the air gap occurs. A method for calibrating non-contact thermal exchange parameters between probe and sample using a single reference sample is proposed and the obtained value of sample thermal conductivity is presented for thin film samples of PANI-CSA infused with varying concentrations of DW-CNTs. Two- to three-fold increase in film thermal conductivity (from 0.4 Wm-1K-1) for the un-doped polymer to 0.8-1.1 Wm-1K-1) is observed for DW-CNT concentration of less than 20% by weight, and a more than seven-fold increase (3.0 Wm-1K-1) is reported for DW-CNT concentration of 30% by weight.
AB - This paper presents a method for determining thermal conductivity of film samples using the non-contact mode scanning hot probe technique at probe-to-sample distances such that Fourier law heat conduction across the air gap occurs. A method for calibrating non-contact thermal exchange parameters between probe and sample using a single reference sample is proposed and the obtained value of sample thermal conductivity is presented for thin film samples of PANI-CSA infused with varying concentrations of DW-CNTs. Two- to three-fold increase in film thermal conductivity (from 0.4 Wm-1K-1) for the un-doped polymer to 0.8-1.1 Wm-1K-1) is observed for DW-CNT concentration of less than 20% by weight, and a more than seven-fold increase (3.0 Wm-1K-1) is reported for DW-CNT concentration of 30% by weight.
KW - Carbon nanotubes
KW - Non-contact thermal analysis
KW - Polymers
KW - Quantitative scanning probe microscopy
KW - Thermal characterization
KW - Thermal conductivity
KW - Thermal interface materials
KW - Thin-film
UR - https://www.scopus.com/pages/publications/85064437882
U2 - 10.1109/ITHERM.2017.8023959
DO - 10.1109/ITHERM.2017.8023959
M3 - 会议稿件
AN - SCOPUS:85064437882
T3 - Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
SP - 71
EP - 78
BT - Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Y2 - 30 May 2017 through 2 June 2017
ER -