@inproceedings{59e9ca37b11041b081c55d93b7084efc,
title = "The Thin Plate Heat Pipe Koch Fractal Wick Structures Investigation",
abstract = "With the fast development of 3D packaging in the power electronics area, the vapor-liquid cooling wick structures integrated into the packages was considered an efficacious heat dissipation solution. The Koch self-similar rule was applied to design different thin vapor-liquid cooling wick structures. As a combination of the T tree and equidistant pillar array, the non-equidistant pillar array design was modeled, fabricated, and investigated. The equidistant pillar array and the non-equidistant pillar array were micro-fabricated into the silicon-glass visualization platforms for the visualization study and the IR measurements. With the smooth corners and suitable pillar pitch arrangement, the non-equidistant hexagon pillar array displayed a better heat dissipation efficiency (approximately 2.6 ± 0.2 times higher). The integrated vapor-liquid wick structure could rapidly and uniformly dissipate the local heat from the transistors into the entire substrate to guarantee the lifetime of the transistors.",
keywords = "Flat-Plate Heat Pipe, Integrated Cooling, Koch Fractal, Micropillar Array",
author = "Jun Liu and Yunqian Song and Zhenyu Wang and Rong Gao and Binbin Jiao and Quan Hu",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018 ; Conference date: 16-05-2018 Through 18-05-2018",
year = "2018",
month = may,
doi = "10.1109/WiPDAAsia.2018.8734607",
language = "英语",
series = "2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "316--319",
booktitle = "2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018",
}