The Study of a SOI Pressure Sensor with High Conductivity for Leadless Package

This paper presents a SOI piezoresistive pressure sensor with high conductivity for leadless package. A square membrane is used as the basic structure of the sensitive membrane, and then a crossbeam featuring variable beam width is added to the square membrane. Silver paste sintering in leadless package is investigated. The effects of heating rate, sintering temperature and sintering time on the porosity and oxidation rate of sintered silver paste are comprehensively analysed for the first time. The optimum silver paste sintering process parameters are determined, and the maximum resistance value of the sintered silver paste is about 2Ω. Finally, the chip is packaged and tested.