TY - JOUR
T1 - The research on MEMS SA device with metal-silicon composite structure
AU - Hu, Tengjiang
AU - Fang, Kuang
AU - Zhang, Zhiming
AU - Jiang, Xiaohua
AU - Zhao, Yulong
N1 - Publisher Copyright:
© 1992-2012 IEEE.
PY - 2019/12
Y1 - 2019/12
N2 - MEMS Safety-and-Arming device is the new generation of SA device, which integrates the mechanism of actuation and barrier. Fabricated by Micro-Nano processing, its minimized structure and easy integration make it indispensable support to the development of weapon miniaturization, integration and intelligence. Confined by the material and fabrication process, the current MEMS SA device displays such problems as the tiny output displacement, weak structural strength and low functional integration. In order to solve these technical difficulties, the silicon based MEMS SA device with metal enhanced structure is proposed in this paper. The process of bulk micromachining and electroplating are integrated together. Based on the SOI substrate, the fabrication of movable structure can be realized. This novel combination equips the device with the qualities of high structural strength and miniaturization. With specific control signal, the MEMS SA device can generate 1 mm output displacement, and change the device status smoothly (safe to armed, or armed to safe). The micro detonator has been integrated in the system. Stimulated by the surge voltage (1400 V), the flyer can be accelerated to the speed of 1370 m/s. The safety and armed function is validated by the high pressure sensor. The test results show that the metal enhanced layer can stay intact after being stroked by the flyer, and the collision pressure has decreased almost 21.4 times (from 13.5 GPa to 632 MPa). [2019-0184].
AB - MEMS Safety-and-Arming device is the new generation of SA device, which integrates the mechanism of actuation and barrier. Fabricated by Micro-Nano processing, its minimized structure and easy integration make it indispensable support to the development of weapon miniaturization, integration and intelligence. Confined by the material and fabrication process, the current MEMS SA device displays such problems as the tiny output displacement, weak structural strength and low functional integration. In order to solve these technical difficulties, the silicon based MEMS SA device with metal enhanced structure is proposed in this paper. The process of bulk micromachining and electroplating are integrated together. Based on the SOI substrate, the fabrication of movable structure can be realized. This novel combination equips the device with the qualities of high structural strength and miniaturization. With specific control signal, the MEMS SA device can generate 1 mm output displacement, and change the device status smoothly (safe to armed, or armed to safe). The micro detonator has been integrated in the system. Stimulated by the surge voltage (1400 V), the flyer can be accelerated to the speed of 1370 m/s. The safety and armed function is validated by the high pressure sensor. The test results show that the metal enhanced layer can stay intact after being stroked by the flyer, and the collision pressure has decreased almost 21.4 times (from 13.5 GPa to 632 MPa). [2019-0184].
KW - MEMS S&A device
KW - metal-silicon barrier
KW - micro detonator
UR - https://www.scopus.com/pages/publications/85077434302
U2 - 10.1109/JMEMS.2019.2946833
DO - 10.1109/JMEMS.2019.2946833
M3 - 文章
AN - SCOPUS:85077434302
SN - 1057-7157
VL - 28
SP - 1088
EP - 1099
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 6
M1 - 8880625
ER -